HLMP-PB00-N0000 Subminiature InGaN Blue LED Lamps

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Flat Top Package
The HLMP-PB00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.

Lead Configurations
All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more infor-mation refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.


  • Subminiature Flat Top Package
    Ideal for Backlighting and Light Piping Applications
  • Color: 468 nm Blue
  • Ideal for Space Limited Applications
  • Axial Leads
  • Available with Lead Configurations for Surface Mount and Through Hole PC Board Mounting


  • Consumer
  • Industrial
  • Computer Peripheral
  • Communication

Lifecycle Status



  • RoHS6
    Fully Compliant

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Samples Available Yes
Color Blue
Color Bin Selection Open
Dimension Lxwxh In Mm 2.2 x 2.1 x 2.2
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type InGaN
Max Qty of Samples 20
Minimum Luminous Intensity (mcd) 25.0
Peak Output Current Min Uom 2a
Mounting Method Surface Mount
Number Of Colors Single
Package Flat Top Subminiature
Test Current (mA) 20.0
Typical Dominant Wavelength (nm) 468
Typical Luminous Intensity (mcd) 60


Data Sheet (2) i
Product Change Notice (PCN) (1) i