Surface Mount ChipLEDs

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This chip LED is designed in an industry standard package for ease of handling and use.

The HSMG-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.


  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40OC to 85OC
  • Right Angle Package Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels

Lifecycle Status



  • RoHS6
    Fully Compliant

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Samples Available Yes
Color Green
Color Bin Selection Open
Dimension Lxwxh In Mm 3.2 x 1.0 x 1.5
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type GaP
Max Qty of Samples 20
Minimum Luminous Intensity (mcd) 4.0
Peak Output Current Min Uom 2a
Mounting Direction Side
Mounting Method Surface Mount
Number Of Colors Single
Operating Temperature Range -40°C to +85°C
Package Right Angle C110
Test Current (mA) 20.0
Typical Dominant Wavelength (nm) 572
Typical Luminous Intensity (mcd) 16
Viewing Angle (degree) 130°


Application Brief (4) i
Application Note (3) i
Data Sheet (1) i
Design Guide (1) i
Product Change Notice (PCN) (3) i