Surface Mount ChipLED

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This chip LED Is designed in an industry standard package for ease of handling and use.

The HSMD-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. This packageis compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.


  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40C to 85C
  • Right Angle Package Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels


  • Keypad backlighting
  • Push-button backlighting
  • LCD backlighting
  • Symbol backlighting
  • Front panel indicator

Lifecycle Status



  • RoHS6
    Fully Compliant

Lifecycle Status


Substance Compliance

  • RoHS6
    Fully Compliant
Specification Value
Lifecycle Active
Distrib. Inventory Yes
Samples Available Yes
Color Orange
Color Bin Selection Open
Dimension Lxwxh In Mm 3.2 x 1.6 x 1.1
Intensity Bin Selection Open
RoHS6 Compliant Y
Led Chip Type GaP
Lens Type Flat Top, Diffused, Untinted
Peak Output Current Min (A) 1
Max Qty of Samples 20
Minimum Luminous Intensity (mcd) 2.5
Peak Output Current Min Uom 2a
Mounting Direction Top
Mounting Method Surface Mount
Number Of Colors Single
Package Top Mount C150
ROHS5_NonLeadFree Y
Test Current (mA) 20.0
Typical Forward Voltage In V 2.2 @ 10 mA
Typical Dominant Wavelength (nm) 604
Typical Luminous Intensity (mcd) 8
Viewing Angle (degree) 170°


Application Brief (4) i
Application Note (3) i
Data Sheet (1) i
Design Guide (1) i
Product Change Notice (PCN) (3) i
Reliability Data Sheet (1) i