WaferCap Chip Scale Packaging

Avago’s innovative WaferCap is the industry’s first semiconductor-based chip scale packaging (CSP) technology. With potential to reach the 100 GHz frequency range for a SMT packaging, WaferCap CSP has the same dimensions as an 0402 component and can reduce the amount of PCB space an RF device occupies by over  50%.   

Currently measuring 1.0 mm x 0.5 mm and a height of only 0.25 mm, WaferCap packaged parts reduce the thickness of any assembly. The ultra small product dimensions and performance levels resulting from WaferCap CSP provide a new level of design flexibility in device placement that will change the way RF designers think about a variety of wireless product designs. 

The new VMMK-3xxx Series is a new family of WaferCap surface mount technology (SMT) products. They expand the existing product line to a total of 20 WaferCap products. We have expanded the functions offered in WaferCap packaging from the VMMK-1xxx and VMMK-2xxx series of products to include positive gain slope LNA, wideband LNA, variable gain amplifier (VGA) and detector functions.

Part Number: 

• VMMK-1218  0.5 to 18GHz Low Noise E-pHEMT in a Wafer Scale Package
• VMMK-1225  0.5 to 26GHz Low Noise E-pHEMT in a Wafer Scale Package
• VMMK-2103  0.5 to 6GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2203  1 to 10GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2303  0.5 to 6GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2403  2 to 4GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2503  1 to 12GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-3113 2-6 GHz Directional Detector in WaferCap SMT Package
• VMMK-3213 6-18 GHz Directional Detector in WaferCap SMT Package
• VMMK-3313 15-33 GHz Directional Detector in WaferCap SMT Package
• VMMK-3413 25-45 GHz Directional Detector in WaferCap SMT Package
• VMMK-3503 0.5-18 GHz Variable Gain Amplifier in WaferCap SMT Package
• VMMK-3603 1-6 GHz Positive Gain Slope Low Noise Amplifier in WaferCap SMT Package
• VMMK-3803 3-11 GHz UWB Low Noise Amplifier in WaferCap SMT Package

• Revolutionary New Chip Scale Packaging Flash Demo

This flash shows a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago's innovative WaferCap is the industry's first semiconductor-based chip scale packaging (CSP) technology. The ultra small product dimensions and performance levels resulting from WaferCap CSP provide a new level of design flexibility in device placement that will change the way RF designers think about a variety of wireless product designs.

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