WaferCap Chip Scale Packaging

Avago’s innovative WaferCap is the industry’s first semiconductor-based chip scale packaging (CSP) technology. With potential to reach the 100 GHz frequency range for a SMT packaging, WaferCap CSP has the same dimensions as an 0402 component and can reduce the amount of PCB space an RF device occupies by over 50%.

Currently measuring 1.0 mm x 0.5 mm and a height of only 0.25 mm, WaferCap packaged parts reduce the thickness of any assembly. The ultra small product dimensions and performance levels resulting from WaferCap CSP provide a new level of design flexibility in device placement that will change the way RF designers think about a variety of wireless product designs. 

Part Number: 

• VMMK-1218  0.5 to 18GHz Low Noise E-pHEMT in a Wafer Scale Package
• VMMK-1225  0.5 to 26GHz Low Noise E-pHEMT in a Wafer Scale Package
• VMMK-2103  0.5 to 6GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2203  1 to 10GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2303  0.5 to 6GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2403  2 to 4GHz E-pHEMT Amplifier in a Wafer Scale Package
• VMMK-2503  1 to 12GHz E-pHEMT Amplifier in a Wafer Scale Package

Revolutionary New Chip Scale Packaging Flash Demo

This flash shows a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago's innovative WaferCap is the industry's first semiconductor-based chip scale packaging (CSP) technology. The ultra small product dimensions and performance levels resulting from WaferCap CSP provide a new level of design flexibility in device placement that will change the way RF designers think about a variety of wireless product designs.