Isolation Products Lead-Free Initiative
With increasing demand from the market and legislation as well as adverse environmental impact on the use of lead (Pb) in solder finishes, electronics industry has been working to provide Lead-Free products.
The majority of electronic products have semiconductor devices (which contain tin (Sn) and lead (Pb)) incorporated on the printed circuit boards. Increasing regulatory and market forces are prompting suppliers and customers to eliminate the use of lead (Pb) in solder finishes because of its detrimental effect on our environment. Discarded components leak lead into the water supply with a large number of negative consequences. As a result the electronics industry has been working diligently to identify and implement alternatives to lead.
Avago Technologies' Isolation Products is committed to provide Lead-Free option in our complete range of plastic isolation products by November 1, 2003.
To identify Lead-Free Parts, click here.
Documents & Downloads
Product Changes Notice (PCN) - PCN: A05-001-32002150-0A, Mar. 2005 (281 KB, PDF)
Product Changes Notice (PCN) - PCN: A04-003-32002150-0A, Apr. 2004 (15 KB, PDF)
FAQs - Avago Technologies Plastic Isolation Products - Frequently Asked Questions (47 KB, PDF)
Product Changes Notice (PCN) - RoHS Labelling Communication Dec. 2006 (232 KB, PDF)