RF & Microwave
New RF WiMAX Front End Solution How-to Video
Designers of mobile WiMAX/WiBRO systems face many challenges when designing and specifying the RF front end. Avago has addressed these concerns with a new solution that consists of three separate small standalone modules. Watch the video...
Revolutionary New Chip Scale Packaging Flash Demo
This flash shows a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago's innovative WaferCap is the industry's first semiconductor-based chip scale packaging (CSP) technology. The ultra small product dimensions and performance levels resulting from WaferCap CSP provide a new level of design flexibility in device placement that will change the way RF designers think about a variety of wireless product designs.