RF & Microwave
HSMS-8202
X-band mixer diode
Description
Features
Documents
Data Sheets & Technical Specifications
- Data Sheet - HSMS-8101, HSMS-8202, HSMS-8207, HSMS-8209, Surface Mount Microwave Schottky Mixer Diodes(215 KB,PDF)
- Data Sheet - HSMS8xxx Surface Mount Microwave Schottky Mixer Diodes(96 KB,PDF)
Application Notes
- Application Note - AN 1052: A Cost, Surface Mount X B Mixer(62 KB,PDF)
- Application Note - AN 1088: Designing the Virtual Battery(1083 KB,PDF)
- Application Note - AN 1136: Cost Mixer for the 10.7 to 12.8 GHz Direct Broadcast Satellite Market(533 KB,PDF)
- Application Note - AN 1156: Diode Detector Simulation EEs ADS Softward(162 KB,PDF)
- Application Note - AN 923: Schottky Barrier Video Detectors(190 KB,PDF)
- Application Note - AN 9441: Microwave Transistor Bias Considerations(1447 KB,PDF)
- Application Note - AN 9561: The Criterion for the Tangential Sensitivity Measurement(123 KB,PDF)
- Application Note - AN 956-3 Flicker Noise Schottky Diodes(160 KB,PDF)
- Application Note - AN 956-4; Schottky Diode Voltage Doubler(81 KB,PDF)
- Application Note - AN 956-5: Dynamic Range Extension Schottky Detectors(112 KB,PDF)
- Application Note - AN 956-6: Temperature Dependence Schottky Detector Voltage Sensitivity (512 KB,PDF)
- Application Note - AN 963: Matching Techniques for Mixers Detectors(1019 KB,PDF)
- Application Note - AN 986: Square Law Linear Detection(663 KB,PDF)
- Application Note - AN 987: Is Bias Current Necessary(115 KB,PDF)
- Application Note - AN 988: All Schottky Diodes are Zero Bias Detectors(769 KB,PDF)
- Application Note - AN A004R: Electrostatic Discharge mage Control(396 KB,PDF)
- Application Note - AN A006: Mounting Considerations for Microwave Semiconductors(87 KB,PDF)
Design & Reference Guides
Obsolescence Notices
Product Change Notices
- Product Changes Notice (PCN) - 022500TC1: Customer Change Notification(18 KB,PDF)
- Product Changes Notice (PCN) - CCN:9811a - HSMS, HBAT laser marking(36 KB,PDF)
- Product Changes Notice (PCN) - CCN#9904A-REVISION B: Customer Change Notice(197 KB,PDF)
- Product Changes Notice (PCN) - CCN021402AT1 - Transfer of semiconductor wafer fabrication(17 KB,PDF)
- Product Changes Notice (PCN) - CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab(24 KB,PDF)
- Product Changes Notice (PCN) - Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002(88 KB,PDF)
- Product Changes Notice (PCN) - PCN: A03-001-480035-1A, Jan 2003(15 KB,PDF)
- Product Changes Notice (PCN) - PCN: A03-003-480035-1A, Sept. 2003(15 KB,PDF)
- Product Changes Notice (PCN) - PCN: A04-012-480035-0A, Dec. 2004(16 KB,PDF)
- Product Changes Notice (PCN) - Qualifying New Contract Manufacturers(348 KB,PDF)
- Product Changes Notice (PCN) - V11-024-480035-0A - Assembly and Test related change(195 KB,PDF)
- Product Changes Notice (PCN) - V11-024-480035-0B - Assembly and Test related change(51 KB,PDF)
Quality & Reliability
