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HSMP-389V
PIN switch diode
Description
The HSMP-389V pin diodes have been optimized for switching applications where low resistance at low bias current and low capacitance are required.
Features
- Ct=0.3pF
- Rs@5mA=2.5ohms
- Tau=200nsec
Documents
Data Sheets & Technical Specifications
- Data Sheet - HSMP-389x, HSMP-489x, Surface Mount RF PIN Switch Diodes(316 KB,PDF)
- Selection Guide - PIN and Schottky Diode(265 KB,PDF)
Application Notes
- Application Brief - Surface Mount Schottky PIN Diode(57 KB,PDF)
- Application Note - AN 1048: Cost Surface Mount PIN Diode Pi Attenuator(178 KB,PDF)
- Application Note - AN 1049: A Distortion PIN Diode Switch Surface Mount Devices(242 KB,PDF)
- Application Note - AN 1067: An SPDT PIN Diode T R Switch for PCN Applications(254 KB,PDF)
- Application Note - AN 1072: Applications for the HSMP3890 Surface Mount Switching PIN Diode(55 KB,PDF)
- Application Note - AN 1124: Linear Models for Diode Surface Mount Packages(119 KB,PDF)
- Application Note - AN 1163: Compact HSMP389V Transmit Receive Switch Design(48 KB,PDF)
- Application Note - AN 922: Applications PIN Diodes(391 KB,PDF)
- Application Note - AN 9571: Broading the Shunt PIN Diode SPDT Switch(90 KB,PDF)
- Application Note - AN 9572: Reducing the Insertion Loss a Shunt PIN Diode(75 KB,PDF)
- Application Note - AN A004R: Electrostatic Discharge mage Control(148 KB,PDF)
- Application Note - AN A006: Mounting Considerations for Microwave Semiconductors(87 KB,PDF)
Obsolescence Notices
Product Change Notices
- Product Changes Notice (PCN) - 022500TC1: Customer Change Notification(18 KB,PDF)
- Product Changes Notice (PCN) - CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change(130 KB,PDF)
- Product Changes Notice (PCN) - CCN:112999tc1 - HSMP-389x and 489x back metal change(12 KB,PDF)
- Product Changes Notice (PCN) - CCN:9710a - HSMS, HSMP #L30, #L31(10 KB,PDF)
- Product Changes Notice (PCN) - CCN#9904A-REVISION B: Customer Change Notice(197 KB,PDF)
- Product Changes Notice (PCN) - CCN021402AT1 - Transfer of semiconductor wafer fabrication(17 KB,PDF)
- Product Changes Notice (PCN) - CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab(24 KB,PDF)
- Product Changes Notice (PCN) - CCN082701TC1 - Si wafer substrate will change from 3" to 4"(22 KB,PDF)
- Product Changes Notice (PCN) - Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002(88 KB,PDF)
- Product Changes Notice (PCN) - PCN: A03-003-480035-1A, Sept. 2003(15 KB,PDF)
- Product Changes Notice (PCN) - PCN: A04-001-480035-0A, Mar. 2004(153 KB,PDF)
- Product Changes Notice (PCN) - PCN: A05-010-480035-0A, Mar. 2005(21 KB,PDF)
- Product Changes Notice (PCN) - Qualifying New Contract Manufacturers(348 KB,PDF)
- Product Changes Notice (PCN) - Recall Notification for SOT-323 (SC-70 3-Lead)(23 KB,PDF)
Quality & Reliability
