LEDs

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HSMY-C170

Surface Mount ChipLEDs

Description

This chip LED is designed in an industry standard package for ease of handling and use.

The HSMY-C170 has the widely used 2.0 x 1.25 mm footprint.

This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.

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Lifecycle status:Active


Features
  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40OC to 85OC
  • Right Angle Package Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
Documents

Data Sheets & Technical Specifications

Application Notes

Design & Reference Guides

Product Change Notices

Quality & Reliability

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