Products > LEDs > Moonstone™ High Power LEDs > Moonstone™ LED Module > ASMT-MAA0-AGH00
ASMT-MAA0-AGH00
1W Power LED Light Source on MCPCB
Avago’s 1W Amber Power LED is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard.
The low package profile is ideal for assemblies with height constrains.
Lifecycle status:
Active
Features [+-]
- Energy efficient
- Exposed pad for excellent heat transfer
- Suitable for reflow soldering process
- High current operation
- Long operation life
- Wide viewing angle
- Silicone encapsulation
- ESD Class HBM Class 3B, > 8000
Applications [+-]
- Architectural lighting
- Garden lighting
- Decorative lighting
Benefits [+-]
High performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard.
The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer.
Documents
[+-]
Data Sheets & Technical Specifications
Avago’s 1W Amber Power LED is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard.
The low package profile is ideal for assemblies with height constrains.
Lifecycle status:
Active
Features [+-]
- Energy efficient
- Exposed pad for excellent heat transfer
- Suitable for reflow soldering process
- High current operation
- Long operation life
- Wide viewing angle
- Silicone encapsulation
- ESD Class HBM Class 3B, > 8000
Applications [+-]
- Architectural lighting
- Garden lighting
- Decorative lighting
Benefits [+-]
High performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard.
The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer.
Documents
[+-]
Data Sheets & Technical Specifications
- Energy efficient
- Exposed pad for excellent heat transfer
- Suitable for reflow soldering process
- High current operation
- Long operation life
- Wide viewing angle
- Silicone encapsulation
- ESD Class HBM Class 3B, > 8000
Data Sheets & Technical Specifications
