LEDs
- Auto Focus Auxiliary Flash LED
- ChipLEDs for Automotive
- High Brightness Surface Mount Lamps
- High Brightness Through Hole Lamps
- High Power LEDs
- Moonstone™ High Power LEDs
- Standard Brightness Through Hole Lamps
- Subminiature Lamps
- Surface Mount ChipLEDs
- Surface Mount PLCC LEDs
- Surface Top Mount Mono Color ChipLEDs
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ASMT-AW31-NUV00
3W High Power LED
Description
This 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available.
The White Power LED is available in the range of color temperature from 2700K to 10000K
The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
The package is compatible with reflow soldering process. This part has a foot print that is compatible to most of the high power LED in the market today.
The White Power LED is available in the range of color temperature from 2700K to 10000K
The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
The package is compatible with reflow soldering process. This part has a foot print that is compatible to most of the high power LED in the market today.
Features
- Available in Red, Red Orange, Amber, Blue, Royal Blue, Cool White, Neutral White and Warm White color
- Energy efficient
- Exposed metal slug for excellent heat transfer
- Compatible with reflow soldering process
- High current operation
- Long operation life
- Wide viewing angle at 140°
- Silicone encapsulation
- Non-ESD sensitive (threshold > 16 kV)
- MSL 2a products
Applications
- Architectural lighting
- Channel backlighting
- Contour lighting
- Retail Display lighting
- Decorative lighting
- Garden lighting
Benefits
- Capable of handling high thermal and high driving current.
- The exposed pad design with metal slug attachment has excellent heat transfer from the package to the motherboard.
- The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
- The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer.
Documents
Data Sheets & Technical Specifications
Application Notes
- Application Note - AN 1060: Surface Mounting SMT LED Indicator Components(138 KB,PDF)
- Application Note - AN 5288, Silicone Encapsulation for LED, Advantages and Handling Precautions(54 KB,PDF)
- Application Note - AN 5305, Handling Moisture Sensitive Surface Mount LED(620 KB,PDF)
- Application Note - AN 5313; Thermal Management of Avago High Power LED Emitter ASMT-Mxxx/ASMT-Axxx/ASMT-Jxxx(516 KB,PDF)
Quality & Reliability
