LEDs
- Auto Focus Auxiliary Flash LED
- ChipLEDs for Automotive
- High Brightness Surface Mount Lamps
- High Brightness Through Hole Lamps
- High Power LEDs
- Moonstone™ High Power LEDs
- Standard Brightness Through Hole Lamps
- Subminiature Lamps
- Surface Mount ChipLEDs
- Surface Mount PLCC LEDs
- Surface Top Mount Mono Color ChipLEDs
ASMT-AW00-NRS00
1W High Power LED
Description
This 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available.
The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K.
The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
The package is compatible with reflow soldering process. This part has a foot print that is compatible to most of the high power LED in the market today
The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K.
The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
The package is compatible with reflow soldering process. This part has a foot print that is compatible to most of the high power LED in the market today
Features
- Available in Red, Amber, Green, Blue, Cool White, Neutral
White and Warm White color - Energy efficient
- Exposed metal slug for excellent heat transfer
- Compatible with reflow soldering process
- High current operation
- Long operation life
- Wide viewing angle at 130°
- Silicone encapsulation
- Non-ESD sensitive (threshold > 16 kV)
- MSL 2a products
Applications
- Architectural lighting
- Channel backlighting
- Contour lighting
- Retail Display lighting
- Decorative lighting
- Garden lighting
Benefits
- High performance energy efficient device which can handle high thermal and high driving current. The exposed pad design with metal slug attachment has excellent heat transfer from the package to the motherboard.
- The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
- The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer.
Documents
Data Sheets & Technical Specifications
Obsolescence Notices
Quality & Reliability
